层数:14
特殊工艺:0.5CSP
表面处理:沉金
材料:高TG FR4
外层线宽/线距:3.5/3.5mil
内层线宽/线距:3/3mil
板厚:1.6mm
最小孔径:0.15mm
Product name: 14 Layer High TG Fine Pitch PCB
Number of layers: 14
Surface finish: ENIG
Base material: High TG FR4
Outer Layer W/S: 3.5/3.5mil
Inner layer W/S: 3/3mil
Thickness: 1.6mm
Min. hole diameter: 0.15mm
Special process: 0.5CSP