应用行业:消费电子设备
层数:6
表面处理:沉金
材料:FR4 TG170
外层线宽/线距:6/4mil
内层线宽/线距:6/4mil
板厚:1.6mm
最小孔径:0.25mm
Product name: 6 Layer High TG ENIG PCB
Number of layers: 6
Surface finish: ENIG
Base material: High TG FR4
Outer Layer W/S: 6/4mil
Inner layer W/S: 6/4mil
Thickness: 1.6mm
Min. hole diameter: 0.25mm