层数:10
特殊工艺:阻抗
表面处理:沉金
材料:FR4 TG170
外层线宽/线距:9/8mil
内层线宽/线距:6.5/6.5mil
板厚:4.0mm
最小孔径:0.5mm
Product name: 10 Layer High TG ENIG Impedance Control PCB
Number of layers: 10
Surface finish: ENIG
Base material: High TG FR4
Outer Layer W/S: 9/8mil
Inner layer W/S: 6.5/6.5mil
Thickness: 4.0mm
Min. hole diameter: 0.5mm
Special process: Impedance Control